Thickness measurement of dies

When optical data carriers are produced, the data are initially transferred to a master. Depending on the number of copies, different dies made of nickel are produced from the master by galvanisation. These dies must show a thickness of 297 µm ± 3 µm for faultless production. It is checked several times during the galvanisation that this dimension is complied with. The company ISEDD GmbH from Bielefeld has developed a measuring device for this which enables fast and accurate inspections of the dies. Capacitive sensors from Micro-Epsilon are used for the thickness measurement.

Micro-Epsilon Japan K.K.
#1003 Facade Building, 1-23-43, Esaka-cho,
Suita-shi, Osaka 564-0063, Japan
Yukihiro.Makinae@micro-epsilon.jp
+81 (0)6 6170 5257
+81 (0)6 6170 5258