Measurement system for cut packaging pieces

Manufacturers in the packaging industry make high demands with regard to their production quality. For sampling inspection for example, the cut pieces of packaging are extracted from the production, placed in a measurement system and a nozzle system draws them down flat by suction. A non-contacting triangulation sensor scans the surface to measure the topography of the cardboard and to determine the line of the grooves, edges and the associated lengths to high accuracy.

Micro-Epsilon Japan K.K.
#1003 Facade Building, 1-23-43, Esaka-cho,
Suita-shi, Osaka 564-0063, Japan
Yukihiro.Makinae@micro-epsilon.jp
+81 (0)6 6170 5257
+81 (0)6 6170 5258